EmerALD process module
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EmerALD is a process module designed to deposit thin conformal metal layers by atomic layer deposition (ALD) for advanced CMOS gate stacks and other applications.
The EmerALD process module utilizes the sequential exposure of a heated wafer to gases, which once in the targeted process parameter range, will chemisorb at the surface and react with the chemisorbed molecules to form the desired material. By repeating this cycle, multiple layers are formed up to the desired thickness. A major advantage of ALD is that the self limiting nature of the process enables fully conformal films. Another advantage is that a variety of materials can be formed at relatively low temperature. The EmerALD reactor chamber is capable of running ALD processes in both thermal and plasma reaction modes. EmerALD also has remote plasma chamber clean capability.
Up to four (4) EmerALD process modules can be configured to ASM's XP cluster wafer handling platform.
Information is up-to-date: 21.06.2017
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